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華為韜定律是什麼?Kirin 2026(MATE 90)會有什麼變化

hightime wrote:
對岸博主爆出麒麟9050...(恕刪)


修正一下評測

官方論文的9050單核心是2084分(GB6),

多核心爆料是天璣9400等級,也是跟蘋果A17 PRO坐一桌的

溫馨提示:天璣9400跟蘋果A17 PRO都是第一代台積電3奈米製程

請酸民不要隨意開除3奈米黨籍

看點是9050的CPU能耗降低的非常驚人,且NPU及GPU提升巨大

對岸博主用三折疊XT2打了一個半小時的鳴潮全特效

手機最高溫度41度,就問你炸裂否
大力士7777 wrote:這版這篇是請AI整理...(恕刪)
極客灣的測試, 一堆人應該講不出話了.

大力士7777 wrote:
極客灣的測試, 一堆...(恕刪)




GOOGLE這下臉都丟光了~~
不相信的人就看看高通做了甚麼事。




高通取得華為 LogicFolding 晶片技術專利授權
Qualcomm licenses patents on Huawei’s LogicFolding chip tech — Bloomberg

Bloomberg News
Mon, Oct 05, 2026 • 05:47 PM GMT+08 • • 2 min read

(Oct 5): Qualcomm Inc has agreed to license patents underpinning Huawei Technologies Co’s novel LogicFolding chipmaking technique, a win for the Chinese company and its push to advance in overseas artificial intelligence (AI) markets.

The multiyear deal is part of a cross-licence agreement between the two chipmakers, spanning technologies related to 5G devices, AI services, near- and co-packaged optics and networks, a Huawei spokesperson said on Monday.

The agreement with Qualcomm helps validate the Shenzhen-based company’s chipmaking capabilities. Huawei sees its new architecture as a breakthrough that boosts semiconductor performance and helps it narrow the gap with industry leaders such as Taiwan Semiconductor Manufacturing Co. That approach focuses on improving data transmission speeds to make up for China’s lack of access to ASML Holding NV’s extreme ultraviolet lithography machines, the gold standard for production of cutting-edge chips.
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