Bloomberg News Mon, Oct 05, 2026 • 05:47 PM GMT+08 • • 2 min read
(Oct 5): Qualcomm Inc has agreed to license patents underpinning Huawei Technologies Co’s novel LogicFolding chipmaking technique, a win for the Chinese company and its push to advance in overseas artificial intelligence (AI) markets.
The multiyear deal is part of a cross-licence agreement between the two chipmakers, spanning technologies related to 5G devices, AI services, near- and co-packaged optics and networks, a Huawei spokesperson said on Monday.
The agreement with Qualcomm helps validate the Shenzhen-based company’s chipmaking capabilities. Huawei sees its new architecture as a breakthrough that boosts semiconductor performance and helps it narrow the gap with industry leaders such as Taiwan Semiconductor Manufacturing Co. That approach focuses on improving data transmission speeds to make up for China’s lack of access to ASML Holding NV’s extreme ultraviolet lithography machines, the gold standard for production of cutting-edge chips.