小仲827 wrote:
你的意思是說wafe...(恕刪)
小仲827 wrote:
嘿嘿....終於把你...(恕刪)
"A bin is then defined as a good or bad die. This wafermap is then sent to the die attachment process which then only picks up the passing circuits by selecting the bin number of good dies. The process where no ink dot is used to mark the bad dies is named substrate mapping. When ink dots are used, vision systems on subsequent die handling equipment can disqualify the die by recognizing the ink dot.
"In some very specific cases, a die that passes some but not all test patterns can still be used as a product, typically with limited functionality. The most common example of this is a microprocessor for which only one part of the on-die cache memory is functional. In this case, the processor can sometimes still be sold as a lower cost part with a smaller amount of memory and thus lower performance. Additionally when bad dies have been identified, the die from the bad bin can be used by production personnel for assembly line setup."
(http://en.wikipedia.org/wiki/Wafer_testing)
"The Pentium FDIV bug was a bug in Intel's original Pentium floating point unit (FPU). Certain floating point division operations performed with these processors would produce incorrect results. According to Intel, there were a few missing entries in the lookup table used by the divide operation algorithm."
(http://en.wikipedia.org/wiki/Pentium_FDIV_bug)
johnnydee wrote:
我並不打算說服你甚麼...(恕刪)
小仲827 wrote:
我只知道世界一等一的大廠Intel ,他們出產的產品有一定品質與水準,只要不是山寨版的Iintel ssd
任何人在市面上買到的Intel ssd 都有Intel 的商品保證,況且也不是Intel 獨有
其他知名3C品牌廠商,對於他們所製造(或販售)的產品,都有相當的品質保證
G2的性能比G1好是眾所皆知,你能反駁嗎?Intel 官網數據是假的嗎??
小仲827 wrote:
我就知道你會提到耐久性(壽命),據側面了解G1跟G2的壽命應該是差不多的,只是臨時google不到相關資料
matika wrote:
X25M-G1使用5...(恕刪)
從 APP 打開
