消息來源︰Intel 官方 PCN 發出通知
修正內容︰
Intel® X58 Express 晶片組中的 IOH 晶片將完成從B-2到B-3步進的過渡
S-Spec（規格編號）將從 SLGBT 轉換到 SLGMX
但B-3步進的規格與 B-2完全相容，因此廠商不必重新設計主機板
只需更換晶片即可。這次主要的改變將會是產品設計上的
消費者預計會在5月中旬購買到新步進的產品，
但是 Intel還有特別聲明，舊步進產品的庫存清貨還得看市場的需求狀況
在庫存完全消化完之前，Intel可能還會繼續銷售舊步進產品。
PCN 編號︰PCN109212-00.pdf
http://tinyurl.com/arufwq
wrote:Description of Change to the Customer:
The IOH component of the Intel® X58 Express chipset is converting from the B-2 stepping to the B-3 stepping. Please plan to validate the B-3 stepping of the Intel® X58 Express chipset. For technical details of the Intel® X58 Express chipset, please refer to the latest Spec Update available on FDBL.
Customer Impact of Change and Recommended Action:
The B-2 stepping of the IOH component of the Intel® X58 Express chipset is pin-to-pin compatible with the B-3 stepping and does not require any motherboard modifications. Design changes, however, have been made to the IOH component of the Intel® X58 Express chipset and will require customers to perform re-qualification. Please see the Intel® X58 Express chipset Spec Update and Intel® X58 Express chipset BIOS Spec Update for any BIOS changes available for the B-3 stepping.
