https://www.intel.com/content/www/us/en/events/ces.html
官方直播 台灣時間6日早上7:00-8:00?
新增YT：
更新：
**小心參考，像332H 322H 2P+4LP才對
https://www.intel.com.tw/content/www/tw/zh/products/sku/245526/intel-core-ultra-x9-processor-388h-18m-cache-up-to-5-10-ghz/specifications.html
4-8-4-12Xe3
5.1-4-3.7-2.5 65w，瞬間80w
2.1-1.6-1.6-0.9? 25w
12Xe3
峰值 122 TOPS（Int8）
10Xe3
峰值 98 TOPS（Int8）
4Xe3
峰值 40,37,
2Xe3
18 TOPS（Int8）
官方規格表還有些錯誤，請小心閱讀
更新：
Panther Lake幾個關鍵問題：筆記本27小時續航？18A工藝產能？...
英特爾正在計劃為手持遊戲平台定制 Panther Lake CPU
A Handheld-Exclusive CPU
Since Intel’s Core Ultra 300 Panther Lake chip is built on Intel’s proprietary 18A Foundry process node, it can be cut in a variety of different die slices.
According to sources at Intel close to the matter, the company is planning a hardware-specific variant or variants of the Panther Lake CPU die. Currently branded as “Intel Core G3” these processors will be custom-built for handhelds. That means Intel can spec the chips to offer better performance on the GPU where you want it, with potential for even better performance than the current Arc B390 expectations.
This is further indication that Intel plans to lean heavily into the handheld gaming PC segment, which Intel first hinted at last year. Combined with the “Handheld Ecosystem” announcement, this is a clear win for gamers.
AMD高層 對 Panther Lake的看法
"There's a reason why they didn't compare it right there. [...] they compared their highest-end to our midpoint." He also subtly exposed that Intel's pricing for Panther Lake won't be pretty: "And, oh, by the way, that 12 Xe [Panther Lake]... Wait until you see the price point on that. It's gonna be, you know. Enough said."
AMD 高層回應英特爾新處理器，自信 Strix Halo 性能更勝一籌
更新：
‘They’re selling ancient silicon’: Intel warns handheld war is coming
Intel 狠酸 AMD 賣「古董晶片」！Panther Lake 誓言奪回掌機市場霸主地位
AMD claims Panther Lake has 'too much baggage' for handheld PC use — fights back after Intel jabs AMD for using 'ancient silicon' in its Z2 series APUs
AMD 回擊英特爾：Panther Lake 處理器“包袱”太重，不適合掌機
intel 低調發佈Wildcat Lake？
Core Series 300
6 核心（2P + 4LPE）
2 個 Xe3 GPU 核心 18?TOPS
Compute Tile 內整合 GPU
同樣使用 Intel 18A
內建 NPU 5 18TOPS
5個SKU
Intel Core Series 3 （無Ultra）主要應用在入門級筆電、Edge 系統、Embedded 市場，預計 2026 年第二季上市。此外，也有消息指出，Core Series 3 未來接替現行的 Alder Lake-N 定位。
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SPARKLE 宣布 Intel® Arc™ Pro B60 24GB 顯示卡系列正式發表
