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AMD 宣布下一代 EPYC 處理器 Venice 已在台積電 N2 製程完成投片 第五代 EPYC 處理器於美國亞利桑那州晶圓廠進行生產

AMD 宣布下一代 EPYC 處理器 Venice 已在台積電 N2 製程完成投片 第五代 EPYC 處理器於美國亞利桑那州晶圓廠進行生產

為符合川普 MAGA 計畫下重返美國製造的目標,台積電昨天晚上接連傳出在美國推進製造進度的消息,包括 NVIDIA 宣布將攜手台積電、鴻海、緯創等公司,在美國建設 5000 億美元的人工智慧基礎設施,以及 BLACKWELL GPU 在台積電亞利桑那州晶圓廠量產的消息。而 AMD 也在稍晚宣布代號為 “Venice” 的新一代AMD EPYC 處理器,是業界首款採用台積電先進 2 奈米(N2)製程技術、完成投片(tape out)的高效能運算(HPC)產品,並且在將在明年上市。

AMD 董事長暨執行長蘇姿丰博士表示,台積電多年來一直是 AMD 重要的合作夥伴,AMD 與台積電研發和製造團隊的深度合作,使 AMD 能夠持續推出領先業界的產品,突破高效能運算的極限。作為台積電 N2 製程以及台積電亞利桑那州晶圓 21 廠的首位 HPC 客戶,充分展現了我們如何緊密合作,共同推動創新並提供先進技術,為未來運算挹注動能。

而台積電董事長暨總裁魏哲家博士表示,台積電很榮幸 AMD 成為首位使用台積公司先進 2 奈米(N2)製程技術,以及在我們亞利桑那州晶圓廠生產的 HPC 客戶。透過合作,我們正在推動顯著的技術擴展,為高效能晶片帶來更卓越的效能、功耗效率和良率。台積電期待持續與 AMD 密切合作,共同開創運算的新世代。
2025-04-15 8:01 發佈
感謝分享&介紹,AMD+TSMC IN USA
那個標題建議可以調整一下~
(已達到提醒效果~ 更新內文~)
謝謝~
eclair_lave

wengtzued確實不是最新製程啊?這新聞講的是兩件事,一個是美廠4nm開始運作(之前就有的新聞),另一個是台灣廠的N2製程上第一個HPC產品投片完成(應該就zen6c),明年正式面世

2025-04-15 18:24
eclair_lave

tsmc美廠的2nm產線要到差不多2028~2029那時的事了

2025-04-15 18:26
AI股又要起飛了嗎...歐硬啦...
kingstone.li wrote:
那個標題...陳爸,...(恕刪)


直接看AMD官網比較快?
https://ir.amd.com/news-events/press-releases/detail/1245/amd-achieves-first-tsmc-n2-product-silicon-milestone

— Next-generation AMD EPYC CPU, codenamed “Venice,” is the first HPC product to be brought up on TSMC’s next-generation N2 node —

SANTA CLARA, Calif., April 14, 2025 (GLOBE NEWSWIRE) -- AMD (NASDAQ: AMD) today announced its next-generation AMD EPYC™ processor, codenamed “Venice,” is the first HPC product in the industry to be taped out and brought up on the TSMC advanced 2nm (N2) process technology. This highlights the strength of AMD and TSMC semiconductor manufacturing partnership to co-optimize new design architectures with leading-edge process technology. It also marks a major step forward in the execution of the AMD data center CPU roadmap, with “Venice” on track to launch next year. AMD also announced the successful bring up and validation of its 5th Gen AMD EPYC™ CPU products at TSMC’s new fabrication facility in Arizona, underscoring its commitment to U.S. manufacturing.

“TSMC has been a key partner for many years and our deep collaboration with their R&D and manufacturing teams has enabled AMD to consistently deliver leadership products that push the limits of high-performance computing,” said Dr. Lisa Su, chair and CEO, AMD. “Being a lead HPC customer for TSMC’s N2 process and for TSMC Arizona Fab 21 are great examples of how we are working closely together to drive innovation and deliver the advanced technologies that will power the future of computing.”

“We are proud to have AMD be a lead HPC customer for our advanced 2nm (N2) process technology and TSMC Arizona fab,” said TSMC Chairman and CEO Dr. C.C. Wei. “By working together, we are driving significant technology scaling resulting in better performance, power efficiency and yields for high-performance silicon. We look forward to continuing to work closely with AMD to enable the next era of computing.”

Supporting Resources

Learn more about AMD EPYC Processors
About AMD
For more than 50 years AMD has driven innovation in high-performance computing, graphics and visualization technologies. Billions of people, leading Fortune 500 businesses and cutting-edge scientific research institutions around the world rely on AMD technology daily to improve how they live, work and play. AMD employees are focused on building leadership high-performance and adaptive products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ: AMD) website, blog, LinkedIn and X pages.

Cautionary Statement
This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as AMD’s partnership with TSMC; next-generation AMD EPYC™ processors to be taped out and brought up on the TSMC advanced 2nm process technology and being on track to launch next year; AMD’s data center CPU roadmap; and 5th Gen AMD EPYC™ CPU products being planned for shipment later this year, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation’s dominance of the microprocessor market and its aggressive business practices; Nvidia’s dominance in the graphics processing unit market and its aggressive business practices; competitive markets in which AMD’s products are sold; the cyclical nature of the semiconductor industry; market conditions of the industries in which AMD products are sold; AMD’s ability to introduce products on a timely basis with expected features and performance levels; loss of a significant customer; economic and market uncertainty; quarterly and seasonal sales patterns; AMD's ability to adequately protect its technology or other intellectual property; unfavorable currency exchange rate fluctuations; ability of third party manufacturers to manufacture AMD's products on a timely basis in sufficient quantities and using competitive technologies; availability of essential equipment, materials, substrates or manufacturing processes; ability to achieve expected manufacturing yields for AMD’s products; AMD's ability to generate revenue from its semi-custom SoC products; potential security vulnerabilities; potential security incidents including IT outages, data loss, data breaches and cyberattacks; uncertainties involving the ordering and shipment of AMD’s products; AMD’s reliance on third-party intellectual property to design and introduce new products; AMD's reliance on third-party companies for design, manufacture and supply of motherboards, software, memory and other computer platform components; AMD's reliance on Microsoft and other software vendors' support to design and develop software to run on AMD’s products; AMD’s reliance on third-party distributors and add-in-board partners; impact of modification or interruption of AMD’s internal business processes and information systems; compatibility of AMD’s products with some or all industry-standard software and hardware; costs related to defective products; efficiency of AMD's supply chain; AMD's ability to rely on third party supply-chain logistics functions; AMD’s ability to effectively control sales of its products on the gray market; long-term impact of climate change on AMD’s business; impact of government actions and regulations such as export regulations, tariffs and trade protection measures; AMD’s ability to realize its deferred tax assets; potential tax liabilities; current and future claims and litigation; impact of environmental laws, conflict minerals related provisions and other laws or regulations; evolving expectations from governments, investors, customers and other stakeholders regarding corporate responsibility matters; issues related to the responsible use of AI; restrictions imposed by agreements governing AMD’s notes, the guarantees of Xilinx’s notes and the revolving credit agreement; impact of acquisitions, joint ventures and/or strategic investments on AMD’s business and AMD’s ability to integrate acquired businesses, such as ZT Systems; impact of any impairment of the combined company’s assets; political, legal and economic risks and natural disasters; future impairments of technology license purchases; AMD’s ability to attract and retain qualified personnel; and AMD’s stock price volatility. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to AMD’s most recent reports on Forms 10-K and 10-Q.

AMD, the AMD Arrow logo, EPYC and combinations thereof, are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.
柳林中的哭聲

先卡 有空再用翻譯看內文

2025-04-15 10:21
hermas

its commitment to U.S. manufacturing.

2025-04-15 15:12
在美帝國生産的....上市價格?
eclair_lave

或許不單純製程問題,除1P時,XEON6的2P效率也比一般平均要更低(雖然EPYC9005的2P效率也稱不上多好),或許架構有問題還是有什麼BUG,導致單顆核心的性能優勢在整體運作下效率無法良好發揮

2025-04-26 18:43
ya19881217

eclair_lave 感覺是兩顆cpu間靠pcb板的佈線 跨封裝間的通訊延遲跟頻寬拉不起來 2P效率一直不是很高

2025-05-10 8:54
在美生產

在川普 朝夕令改 亂權下

所有產業 都有不安的變數
plankton

投產美積電也有向川普宣示效忠之意。

2025-04-15 13:16
選舉

AMD Ryzen Threadripper PRO 這種cpu主機板 看起來蠻高貴的 量少 我是不會碰

2025-04-15 17:10
美國狂人又想來參一腳了
很不錯的新聞 很期待後續的其他報導
蔥油餅大叔

好像是因為會綁主機板

2025-04-16 12:17
eclair_lave

可以綁但廠商不一定都會啟動那功能(大廠出的套裝機是會鎖),不過為了保險起見坊間賣二手的會連原或該套裝同牌的MB一起組配套販售

2025-04-18 18:16
這次AMD那麼快就投產最新製程!,要知道以前AMD都拖1~2年才投產最新製程,因為最新製程太貴了!
pc8801

個人電腦就不行,但伺服器可能不差那點錢,又或者說伺服器本來就貴

2025-04-15 13:51
tonyboy015

另外庫克被關稅嚇到猶豫才讓蘇嬤先登,不然新製程都嘛蘋果過完水才讓別人試試[汗]

2025-04-15 16:07
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