Because chiplets are small and TSMC defect density is low on average 93.5% of all Zen2 chiplets have 0 defects and AMD gets 749 fully functional 8-core chiplets from a single 300mm wafer - enough for 187 32-core Epyc CPUs.
By comparison Intel's 28-core Xeon is huge ( 32 x 29 mm ) so with the same defect rate Intel would have 46% defect-free dies - would only get 24 CPUs from a single 300mm wafer.