Chartered Semi-conductor弄了20幾年,
已經破產好多次,新加坡的主權基金一次次救起來.
最終還是放棄,賣給Global Foundary.
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近的,中國中芯也搞了幾十年,
從張汝京以降,不知道從台積電挖過多少人.
中國政府隨便也砸下幾百億元,上千億元的.
如何呢?
除了技術還是遠遠落後在台積電後面.
中芯是一家幾乎年年虧錢的公司.
少數幾年的帳面獲利,如果扣除中國政府的巨額補貼,它還是年年虧錢的.
以下是CNBC引述中國政府的官媒-環球時報的報導.
中芯已經正在幫華為生產低階手機晶片Kirin 710A.
但是高階手機晶片Kirin990需要使用7nm製程,
只有台積電有成熟的技術,它已經量產兩年多.
中芯至今沒有能力以7nm製程代工高階的華為晶片Kirin 990.
https://www.cnbc.com/2020/05/18/huawei-faces-big-blow-from-new-us-rules-to-cut-off-chips.html
State-backed publication Global Times reported last week that SMIC had begun mass production of Huawei’s Kirin 710A chip. This processor is designed for a lower tier phone under Huawei’s budget Honor brand. This chip is only for one device and does not solve Huawei’s problems for the rest of its product portfolio.
Huawei declined to comment on the Global Times report.
On top of that, “TSMC is miles ahead of SMIC in terms of leading edge technology prowess, capacity and scale,” according to Neil Shah, research director at Counterpoint Research, who added the new U.S. rules could be a “big blow” for Huawei.
Huawei’s flagship chip, the Kirin 990, is based on so-called 7-nanometer technology. This essentially refers to the size of certain aspects of the chips. These 7nm chips are smaller and faster than predecessors.
TSMC has been producing these for around two years. It’s unclear when SMIC may introduce a 7nm production process at scale. So even if Huawei wanted to switch production to SMIC, the chipmaker might not be able to actually produce those parts.
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