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國外網站的360 60G拆機報告

來源:Xbox-Scene

Inside the 60GB Xbox 360 - Bottom RAM Chips Gone
>> Benheck got his hands on a new 60GB (Pro) Xbox 360 console.
Essentially it's nothing more than a 20GB 'Pro' console with the external HDD swapped out to a 60GB model. However opening new SKUs is always interesting as they often have a recent manufacturing date. Benheck's 60GB 360 was made on June 20th 2008.
Motherboards are probably the same across all different SKUs, but the date a certain motherboard revision goes in production can differ per factory plant and production line.

So what's interesting here? ... the motherboard has HANA/HDMI, 90nm GPU, 65nm CPU, 175W PSU, the GPU heatsink with the 'addon' and the new CPU heatsink without the copper heatpipe ... so basically it looks like a normal Falcon board. The DVD drive found in this console was the new Lite-On DG-16D2S we're starting to see more and more these days.
But Benheck found a difference ... the RAM chips at the bottom of the board are gone (so the 4 chips on the top must have doubled in capacity).


Ah, I have found a difference! This is the first Xbox 360 I have seen that does not have the bottom-mounted memory chips. I had heard on the interwebs these have been a heat problem in the past (or moreso that people fixed problems by improving their heat sink to the case) so I'm sure this will help performance as well as aid cost reduction.
2008-08-07 18:59 發佈
一整篇文章就是在找CPU和GPU製程,結果出爐了...
GPU:90奈米
CPU:65奈米
結論:微軟真有你的
這是指新製程嗎!?.........意思是該入手360 60G!?
the motherboard has HANA/HDMI, 90nm GPU, 65nm CPU, 175W PSU

原文有寫到
GPU:90
CPU:65
所以不是雙65???
重點在於下面這段話

So what's interesting here? ... the motherboard has HANA/HDMI, 90nm GPU, 65nm CPU, 175W PSU, the GPU heatsink with the 'addon' and the new CPU heatsink without the copper heatpipe ...
那一段不就是說散熱片沒導熱銅管
那代表著???
還是等專業的來測試公怖答案

如果可以說的話,有人知道XBOX 360 motherboard為何要由世界工廠製作,再運來台灣測試
而且光motherboard測試良率就不高.真的是motherboard有問題還是CPU.GPU製程問題
我也不知道???
rong1102 wrote:
那一段不就是說散熱片...(恕刪)


是的,轉貼文章的那段話就是說明沒有銅散熱導管
就文中來看,60G的版本還是有優點的,
主機板背面GPU旁的四顆記憶體拿掉了,
看來是加大了焊在正面的記憶體,
這四顆脫焊當初就是懷疑造成3紅的原因之一,
因為這四顆記憶體開機後其實相當熱,
在主機板背面散熱效果也不好,
當初坊間救3紅的橡皮擦法所墊的就是這四顆,
看起來微軟自己很清楚問題在哪裡~
以前就知道一些事了
不敢也不想亂講,被人罵沒關係
被大鯨魚告才衰

一切就等它官方說法或專業人事來說吧
這裡還有另外一篇拆機報告.
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